Broadband Matching of PA-to-PCB Interconnection for X-band Wireless Power Transfer
| Autor: | Ramazan Kopru |
|---|---|
| Přispěvatelé: | Işık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümü, Işık University, Faculty of Engineering, Department of Electrical-Electronics Engineering, Köprü, Ramazan |
| Rok vydání: | 2019 |
| Předmět: |
X-band frequencies
Broadband matching Broadband WPT application Frequency 8.0 GHz to 12.0 GHz Simplified real frequency technique Wire Resonant wireless Microstrip antennas Wideband amplifiers Wireless power transfer Microwaves WPT circuit Physics Tidal power Inductive power transmission Electrical engineering Impedance Unit element Electric power system interconnection Power amplifier MMIC chip Energy transfer Microwave wireless power transfer Optimization Microwave integrated circuits Printed circuit interconnections Monolithic microwave integrated circuits MMIC power amplifiers Equivalent LC parasitic impedance Microwave energy X bands Integrated circuit design Microstrip SRFT PA-to-PCB interconnection Unit element bandpass matching network Microstrip antenna Microwave antennas X-band wireless power transfer Microwave power transmission AWR MWO X-band microstrip patch antenna Broadband amplifiers Integrated circuit packaging Microwave wideband microstrip UE BPMN Monolithic microwave integrated circuit Microwave amplifiers business.industry Broad band matching Amplifier Soldering Microwave transmission Lead bonding Wires Radio Microstrip unit elements Multiple microwave harvester receivers Slot antennas X-band commercial PA MMIC Microwave circuits X-band business Power amplifiers Bond wire Microwave |
| Zdroj: | 2019 International Conference on Power Generation Systems and Renewable Energy Technologies (PGSRET). |
| DOI: | 10.1109/pgsret.2019.8882695 |
| Popis: | The author presents his gratitudes to Isik University for the encouragement of him to present the paper in the conference of PGSRET-2019 and also the financial support of him. Design and simulation of a microwave wideband microstrip unit element bandpass matching network is presented, potential use might be a broadband WPT (microwave wireless power transfer) application in X-band frequencies (8-12 GHz). The source of the main energy can be wind, fossil, tidal, solar, nuclear, hydro etc. and the main energy can be converted from DC to microwave energy which then can be transmitted via the proposed WPT circuit towards a few or a network of a multiple microwave harvester receivers located at a near or far field from the main source. In the work, a bandpass matching network (BPMN) composed of microstrip "unit elements (UEs)" is designed to operate along the whole X-band (8-12 GHz). Designed BPMN is excited by an X-band commercial PA (power amplifier) MMIC (monolithic microwave integrated circuit) packaged chip, and it is loaded by an X-band microstrip patch antenna. A bond wire soldered between the RF output pad of MMIC chip and the input pad of the BPMN has an equivalent LC parasitic impedance assumed to be the generator complex impedance that must be compensated in a typical matching problem. SRFT (simplified real frequency technique) is used in the design of the matching network that compensates the effect of bond wire and very good agreement found between the theoretical design and simulations done in MWO (AWR). Int Islam Univ Gazi Univ, Tech Fac Int Islam Univ, Fac Engn & Technol Publisher's Version WOS:000611393300021 |
| Databáze: | OpenAIRE |
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