Formation mechanism of interfacial microstructures and mechanical properties of Ti2AlNb/Ni-based superalloy joints brazed with NiCrFeSiB filler metal
Autor: | Xinyu Ren, Huaping Xiong, Haishui Ren, Shujie Pang, Weimin Long, Bo Chen |
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Jazyk: | angličtina |
Rok vydání: | 2021 |
Předmět: |
Materials science
Scanning electron microscope Alloy Mechanical properties 02 engineering and technology Electron microprobe engineering.material 010402 general chemistry 01 natural sciences Ultimate tensile strength lcsh:TA401-492 Brazing General Materials Science Composite material Microstructure Filler metal 021001 nanoscience & nanotechnology 0104 chemical sciences Superalloy Ti2AlNb alloy engineering Ni-based superally lcsh:Materials of engineering and construction. Mechanics of materials 0210 nano-technology |
Zdroj: | Progress in Natural Science: Materials International, Vol 31, Iss 2, Pp 310-318 (2021) |
ISSN: | 1002-0071 |
Popis: | Dissimilar brazing of Ti2AlNb-based alloy and Ni-based wrought superalloy (GH536) was studied using NiCrFeSiB filler metal. The Ti2AlNb/GH536 joints were analyzed by scanning electron microscope (SEM) equipped with an electron probe micro-analyzer (EPMA), X-ray diffraction (XRD) and transmission electron microscopy (TEM). The formation mechanism of interfacial microstructure and mechanical properties of Ti2AlNb/GH536 joints were studied. The results indicated that Ti2Ni(Al,Nb), AlNi2Ti and TiB2 reaction layers were formed in the joint adjacent to Ti2AlNb base metal. These layers resulted in high micro-hardness and the weak link of the joint. γ solid solution was formed through isothermal solidification and β1-Ni3Si phase precipitated in the γ solid solution during cooling process. Ni3B, β1-Ni3Si and CrB phases appeared in the centre of the joint. Blocky and needle-like borides formed within the diffusion affected zone of GH536 base alloy. The maximum tensile strength of Ti2AlNb/GH536 joints reached 425 MPa at room temperature and the strength value of 373 MPa was maintained at 923 K. |
Databáze: | OpenAIRE |
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