BIST of interconnection lines in the pixel matrix of CMOS imagers
| Autor: | Fei Richun, Salvador Mir, J. Moreau |
|---|---|
| Přispěvatelé: | STMicroelectronics, Institut de Chimie Moléculaire de Reims - UMR 7312 (ICMR), SFR Condorcet, Université de Reims Champagne-Ardenne (URCA)-Université de Picardie Jules Verne (UPJV)-Centre National de la Recherche Scientifique (CNRS)-Université de Reims Champagne-Ardenne (URCA)-Université de Picardie Jules Verne (UPJV)-Centre National de la Recherche Scientifique (CNRS)-SFR CAP Santé (Champagne-Ardenne Picardie Santé), Université de Reims Champagne-Ardenne (URCA)-Université de Picardie Jules Verne (UPJV)-Université de Reims Champagne-Ardenne (URCA)-Université de Picardie Jules Verne (UPJV)-Université de Reims Champagne-Ardenne (URCA)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS), Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS), Université de Reims Champagne-Ardenne (URCA)-Université de Picardie Jules Verne (UPJV)-Université de Reims Champagne-Ardenne (URCA)-Université de Picardie Jules Verne (UPJV)-Université de Reims Champagne-Ardenne (URCA)-Centre National de la Recherche Scientifique (CNRS), Techniques of Informatics and Microelectronics for integrated systems Architecture (TIMA), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA) |
| Jazyk: | angličtina |
| Rok vydání: | 2013 |
| Předmět: |
010302 applied physics
Interconnection Engineering Pixel business.industry 020208 electrical & electronic engineering ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Image processing 02 engineering and technology Hardware_PERFORMANCEANDRELIABILITY built-in self test 01 natural sciences Built-in self-test CMOS CMOS image sensor PACS 85.42 0103 physical sciences Fault coverage 0202 electrical engineering electronic engineering information engineering Electronic engineering Noise (video) Image sensor [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics business |
| Zdroj: | 5th International Workshop on Advances in Sensors and Interfaces (IWASI), Bari, Italy 5th International Workshop on Advances in Sensors and Interfaces (IWASI) 5th International Workshop on Advances in Sensors and Interfaces (IWASI), Jun 2013, Bari, Italy. pp.174-177, ⟨10.1109/IWASI.2013.6576068⟩ IWASI |
| DOI: | 10.1109/IWASI.2013.6576068⟩ |
| Popis: | ISBN : 978-1-4799-0039-8; International audience; Interconnection lines in the sensors of CMOS imagers are used for pixel bias, addressing and readout. Catastrophic faults in these lines can cause parts of the pixel matrix to operate incorrectly and produce image defects like residual stripes and bands in images. These kinds of image defects are often difficult to remove by the image processing correction algorithm, and they are clearly visible as a sort of noise pattern. Among the defects in the pixel array, these catastrophic faults have most important influence on yield. In addition, partially degraded metal lines cannot be detected on todays' standard industrial testers for image sensors. These defects can evolve into catastrophic faults and they are the main cause of customer returns for many products. This paper proposes two built-in self-test (BIST) solutions to catch these defects in the pixel array, taking into account the industrial test constraints, namely increase of fault coverage, decrease of test time and test cost minimization. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|