Surface generation analysis in micro end-milling considering the influences of grain
Autor: | J. S. Wang, Y. D. Gong, Kui Chen, G. Q. Cai, J. S. Shi, G. Abba |
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Rok vydání: | 2007 |
Předmět: |
FOS: Computer and information sciences
Surface (mathematics) Engineering drawing Materials science Other Computer Science (cs.OH) Chip formation Condensed Matter Physics Electronic Optical and Magnetic Materials Micrometre Machining Computer Science - Other Computer Science Hardware and Architecture Phase (matter) Grain boundary Electrical and Electronic Engineering Composite material Anisotropy Elastic modulus |
Zdroj: | Microsystem Technologies. 14:937-942 |
ISSN: | 1432-1858 0946-7076 |
DOI: | 10.1007/s00542-007-0478-y |
Popis: | Micro end-milling method is a universal micro manufacturing method, which can be used to fabricating complex 3D structures and parts with many materials. But compared with their micrometer order size, their surface roughness quality is not satisfied. In this paper, the different metal phase grains influences are researched, and the micro end-milling process is described while the material is anisotropic. In this paper, the physical characteristics of different grains, especially friction coefficient and elastic module, are very critical to determine the chip formation process and surface generation. The chip is often discontinues because of the grain boundary effect. Through the micro end-milling experiment, the bottom surface results correlate very well with the theory analysis. Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing) |
Databáze: | OpenAIRE |
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