| Autor: |
Chris Bailey, Tim Tilford, A.K. Parrott, George Goussetis, K.I. Sinclair, Alan J. Sangster, Marc P.Y. Desmulliez |
| Rok vydání: |
2008 |
| Předmět: |
|
| Zdroj: |
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT). |
| DOI: |
10.1109/iemt.2008.5507869 |
| Popis: |
Comparison of the performance of a conventional convection oven system with a dual-section microwave system for curing thermosetting polymer encapsulant materials has been performed numerically. A numerical model capable of analysing both the convection and microwave cure processes has been developed and is breifly outliines. The model is used to analyse the curing of a commercially available encapsulant material using both systems. Results obtained from numerical solutions are presented, confirming that the VFM system enables the cure process to be carried out far more rapidly than with the convection oven system. This capability stems from the fundamental heating processes involved, namely that microwave processing enables the heating rate to be varied independently of the material temperature. Variations in cure times, curing rates, maximum temperatures and residual stresses between the processes are fully discussed. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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