Ring-Opening-Induced Toughening of a Low-Permittivity Polymer−Metal Interface
Autor: | Ganpati Ramanath, Saurabh Garg, N. Ravishankar, Jitendra S. Rathore, Binay Singh, Leonard V. Interrante, R. Moore |
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Rok vydání: | 2010 |
Předmět: |
Permittivity
chemistry.chemical_classification Toughness Manufactured Materials Materials science Polymers Surface Properties chemistry.chemical_element Anchoring Polymer Copper Catalysis Metal chemistry Hardness visual_art Materials Testing Electric Impedance visual_art.visual_art_medium General Materials Science Composite material Curing (chemistry) |
Zdroj: | ACS Applied Materials & Interfaces. 2:1275-1280 |
ISSN: | 1944-8252 1944-8244 |
DOI: | 10.1021/am1001597 |
Popis: | Integrating low dielectric permittivity (low-k) polymers to metals is an exacting fundamental challenge because poor bonding between low-polarizability moieties and metals precludes good interfacial adhesion. Conventional adhesion-enhancing methods such as using intermediary layers are unsuitable for engineering polymer/metal interfaces for many applications because of the collateral increase in dielectric permittivity. Here, we demonstrate a completely new approach without surface treatments or intermediary layers to obtain an excellent interfacial fracture toughness of13 J/m(2) in a model system comprising copper and a cross-linked polycarbosilane with k approximately 2.7 obtained by curing a cyclolinear polycarbosilane in air. Our results suggest that interfacial oxygen catalyzed molecular ring-opening and anchoring of the opened ring moieties of the polymer to copper is the main toughening mechanism. This novel approach of realizing adherent low-k polymer/metal structures without intermediary layers by activating metal-anchoring polymer moieties at the interface could be adapted for applications such as device wiring and packaging, and laminates and composites. |
Databáze: | OpenAIRE |
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