Wire bond degradation under thermo- and pure mechanical loading
| Autor: | Kjeld Møller Pedersen, Dennis Achton Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Kristian Bonderup Pedersen, Vladimir Popok |
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| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Work (thermodynamics) Wire bonding Materials science business.industry Bond 02 engineering and technology Temperature cycling Structural engineering 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Power module 0103 physical sciences Fracture (geology) Degradation (geology) Electrical and Electronic Engineering Composite material 0210 nano-technology Safety Risk Reliability and Quality business Diode |
| Zdroj: | Microelectronics Reliability. :373-377 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2017.07.055 |
| Popis: | This paper presents a fundamental study on degradation of heavy Al bond wires typically used in high power modules. Customized samples are designed to only consist of Al bond wires on standard Si diodes. These samples are subjected to pure mechanical and passive thermal cycling to investigate the bond degradation behavior on a simple system as well as compare these two test methods. Although an appreciable difference in fracture behavior is observed between these two methods, both provide correlation between the number of cycles and degree of degradation, especially in the case of the passive thermal test. To enable investigation of degradation rate a large number of bond interfaces is analyzed and they are found to follow conventional accepted fracture laws like Paris-Erdogan. With additional work this could enable the possibility of obtaining empirical parameters to be used in actual physics based lifetime laws. |
| Databáze: | OpenAIRE |
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