Vertically Stacked Color Tunable Light-Emitting Diodes Fabricated Using Wafer Bonding and Transfer Printing

Autor:	Tak Jeong, Seong-Ju Park, Kwang Jae Lee, Hyung Joo Lee, Jaeyi Chun, Wonmo Kang, Bong-Joong Kim, Young-Chul Leem, Jong Hyeob Baek
Rok vydání:	2014
Předmět:	Materials science business.industry Wafer bonding Substrate (electronics) Laser law.invention Indium tin oxide Transfer printing law Optoelectronics General Materials Science business Layer (electronics) Diode Light-emitting diode
Zdroj:	ACS Applied Materials & Interfaces. 6:19482-19487
ISSN:	1944-8252 1944-8244
Popis:	We report on the vertically stacked color tunable light-emitting diodes (LEDs) fabricated using wafer bonding with an indium tin oxide (ITO) layer and transfer printing by the laser lift-off process. Employing optically transparent and electrically conductive ITO as an adhesion layer enables to bond the GaN-based blue and AlGaInP-based yellow LEDs. We find out that the interdiffusion of In, O, and Ga at the interface between ITO and GaP allows the strong bonding of the heterogeneous optoelectronic materials and the integration of two different color LEDs on a single substrate. The efficacy of this method is demonstrated by showing the successful control of color coordinate from the vertically stacked LEDs by modulating the individual intensity of blue and yellow emissions.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eb7da63840accd7acecad8bff86c2863 https://doi.org/10.1021/am505415q Zobrazit plný text záznamu