Numerical and Experimental Evaluation of the Microsecond Pulsed Heating Curve Technique Dedicated to Die Interconnection Characterization
| Autor: | Jean-Christophe Crebier, Laurent Dupont, Zoubir Khatir, Benoit Thollin, Pierre-Olivier Jeannin, Yvan Avenas |
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| Přispěvatelé: | Laboratoire des Technologies Nouvelles (IFSTTAR/COSYS/LTN), Institut Français des Sciences et Technologies des Transports, de l'Aménagement et des Réseaux (IFSTTAR) |
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Interconnection Materials science Thermal resistance TEMPERATURE MEASUREMENT 020208 electrical & electronic engineering Mechanical engineering 02 engineering and technology 01 natural sciences Temperature measurement Industrial and Manufacturing Engineering [SPI.TRON]Engineering Sciences [physics]/Electronics Electronic Optical and Magnetic Materials MESURE DE TEMPERATURE Power module 0103 physical sciences Thermal 0202 electrical engineering electronic engineering information engineering Water cooling Electronic engineering SEMICONDUCTEUR Electrical and Electronic Engineering Electrical impedance COMPOSANT ELECTRONIQUE Diode |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2016, 6 (6), pp. 835-45. ⟨10.1109/TCPMT.2016.2554538⟩ |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2016.2554538 |
| Popis: | This paper describes and qualifies a partial thermal impedance measurement technique to evaluate the thermal behavior of the physical layers close to the die in power electronic assemblies. The measurement approach is derived from the pulsed heating curve method; nonetheless, the experimental setup proposed here is fitted for a higher sensitivity analysis of die interconnections due to the extraction of the transient thermal impedance at very high current levels and short heating times. Another advantage of this method is that the cooling efficiency of the system has no impact on the sensitivity of the measurements, which makes it particularly suitable for aging monitoring or in-line manufacturing process control. The method is then implemented with power diodes in order to compare the thermal impedance of two power modules with different solder void repartitions. Experimental results and finite-element simulations show that this method has a very good sensitivity and can, therefore, be used to compare the quality of different die attaches without requiring an efficient power module cooling system. |
| Databáze: | OpenAIRE |
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