Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results
| Autor: | Philippe Artillan, Grégory Houzet, Khadim Dieng, Yann Lamy, Cedric Bermond, Thierry Lacrevaz, Ossama El Bouayadi, Bernard Flechet |
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| Přispěvatelé: | Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation (IMEP-LAHC), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Institut National Polytechnique de Grenoble (INPG)-Centre National de la Recherche Scientifique (CNRS), Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry]) |
| Rok vydání: | 2014 |
| Předmět: |
Permittivity
Materials science packaging Relative permittivity 02 engineering and technology Dielectric Molding (process) Integrated circuit 01 natural sciences Industrial and Manufacturing Engineering law.invention law 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Electronic engineering characterization high frequencies (HFs) [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics Electrical and Electronic Engineering Wideband dielectric 3D integration 010302 applied physics business.industry 020206 networking & telecommunications molding material permittivity 3-D IC [SPI.TRON]Engineering Sciences [physics]/Electronics Electronic Optical and Magnetic Materials [SPI.ELEC]Engineering Sciences [physics]/Electromagnetism Interposer Optoelectronics molding Antenna (radio) wideband business 3DIC |
| Zdroj: | IEEE Transactions on Components Packaging and Manufacturing Technology Part B IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Institute of Electrical and Electronics Engineers (IEEE), 2014, 4 (9), pp.1515-1522. ⟨10.1109/TCPMT.2014.2337511⟩ |
| ISSN: | 2156-3985 2156-3950 1070-9894 |
| DOI: | 10.1109/tcpmt.2014.2337511 |
| Popis: | International audience; This paper deals with the wideband frequency molding material characterization in three dimensions stack of integrated circuits (3-D IC). This material is required as a passivation layer at the top of an element called interposer. The interposer constitutes a platform that allows to connect heterogeneous chips, for example, a radio frequency transceiver, a low-noise amplifier, and an antenna. As the molding material has been recently developed, its performance (electrical proprieties, such as permittivity and loss tangent) must be evaluated in order to predict the impact on the signals propagation. First, the process flow and fabrication steps of the 3-D stack are presented. Then, the wideband frequency characterization method based on transmission lines is described. First, this method requires highfrequency measurements using the same coplanar transmission lines with and without molding material. Second, a deembedding procedure, specifically developed for this 3-D test configuration, is performed. Next, a conformal mapping algorithm to extract the permittivity and the loss tangent of the dielectric is achieved.Finally, results are presented and discussed; for example, the molding relative permittivity is found around a value of 3.7. This value appears relatively constant up to 67 GHz. This result is promising for millimeter-wave applications, and reveals the molding as a potential good candidate for microelectronic manufacturing. |
| Databáze: | OpenAIRE |
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