Ternary polymer nanocomposites with concurrently enhanced dielectric constant and breakdown strength for high‐temperature electrostatic capacitors
Autor: | Bin Yao, Lulu Ren, Yang Liu, He Li, Qing Wang, Zhubing Han, Ding Ai |
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Jazyk: | angličtina |
Rok vydání: | 2020 |
Předmět: |
Materials science
Polymer nanocomposite lcsh:T58.5-58.64 capacitors lcsh:Information technology breakdown strength Dielectric law.invention high temperature Capacitor polymer nanocomposites Affordable and Clean Energy law dielectric constant Breakdown strength lcsh:TA401-492 lcsh:Materials of engineering and construction. Mechanics of materials Composite material Ternary operation |
Zdroj: | InfoMat, Vol 2, Iss 2, Pp 389-400 (2020) InfoMat, vol 2, iss 2 INFOMAT, vol 2, iss 2 |
ISSN: | 2567-3165 |
Popis: | The exploration of high-energy-density electrostatic capacitors capable of operating both efficiently and reliably at elevated temperatures is of great significance in order to meet advanced power electronic applications. The energy density of a capacitor is strongly dependent on dielectric constant and breakdown strength of a dielectric material. Here, we demonstrate a class of solution-processable polymer nanocomposites exhibiting a concurrent improvement in dielectric constant and breakdown strength, which typically show a negative correlation in conventional dielectric materials, along with a reduction in dielectric loss. The excellent performance is enabled by the elegant combination of nanostructured barium titanate and boron nitride fillers with complementary functionalities. The ternary polymer nanocomposite with the optimized filler compositions delivers a discharged energy density of 2.92 J cm−3 and a Weibull breakdown strength of 547 MV m−1 at 150°C, which are 83% and 25%, respectively, greater than those of the pristine polymer. The conduction behaviors including interfacial barrier and carrier transport process have been investigated to rationalize the energy storage performance of ternary polymer nanocomposite. This contribution provides a new design paradigm for scalable high-temperature polymer film capacitors. (Figure presented.). |
Databáze: | OpenAIRE |
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