Dominant Coupling Mechanism for Integrated Circuit Immunity of SOIC Packages Up To 10 GHz
| Autor: | Sjoerd Op 't Land, Richard Perdriau, Mohamed Ramdani |
|---|---|
| Přispěvatelé: | ESEO - RF-EMC (RF-EMC), ESEO-Tech, Université Bretagne Loire (UBL)-Université Bretagne Loire (UBL), Institut d'Électronique et des Technologies du numéRique (IETR), Nantes Université (NU)-Université de Rennes 1 (UR1), Université de Rennes (UNIV-RENNES)-Université de Rennes (UNIV-RENNES)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Université de Rennes (UNIV-RENNES)-Institut National des Sciences Appliquées (INSA)-CentraleSupélec-Centre National de la Recherche Scientifique (CNRS), French national project SEISME (simulation of emissions and immunity of electronic systems), Université Bretagne Loire (UBL)-École supérieure d'électronique de l'ouest [Angers] (ESEO)-Université Bretagne Loire (UBL)-École supérieure d'électronique de l'ouest [Angers] (ESEO), Université de Nantes (UN)-Université de Rennes (UR)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-CentraleSupélec-Centre National de la Recherche Scientifique (CNRS), Université de Nantes (UN)-Université de Rennes 1 (UR1) |
| Jazyk: | angličtina |
| Rok vydání: | 2018 |
| Předmět: |
02 engineering and technology
Integrated circuit Voltage regulator ICIM-RI law.invention Printed circuit board Interference (communication) law EMC 0202 electrical engineering electronic engineering information engineering Electronic engineering ICIM-CI Electrical and Electronic Engineering Physics Coupling business.industry Attenuation 020208 electrical & electronic engineering ROME Electrical engineering integrated circuit Small Outline Integrated Circuit 020206 networking & telecommunications modeling Condensed Matter Physics GDPI immunity GTEM Atomic and Molecular Physics and Optics [SPI.TRON]Engineering Sciences [physics]/Electronics Mechanism (engineering) [SPI.ELEC]Engineering Sciences [physics]/Electromagnetism business |
| Zdroj: | IEEE Transactions on Electromagnetic Compatibility IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2018, 60 (4), pp.965-970. ⟨10.1109/TEMC.2017.2756915⟩ IEEE Transactions on Electromagnetic Compatibility, 2018, 60 (4), pp.965-970. ⟨10.1109/TEMC.2017.2756915⟩ |
| ISSN: | 0018-9375 |
| DOI: | 10.1109/TEMC.2017.2756915⟩ |
| Popis: | As the frequency of functional signals and interfering fields is rising beyond 1 GHz, the immunity of integrated circuits (ICs) against these higher frequencies is interesting. To design test setups that mimic the real-world interference an IC may receive, the dominant coupling mechanism (radiation or conduction) needs to be known. We hypothesize that the dominant coupling mechanism is conduction for small outline integrated circuit (SOIC) packages up to about 10 GHz. To challenge this hypothesis, the radiated immunity of a printed circuit board trace connected to a voltage regulator IC is predicted and measured. The radiated immunity is predicted to be the product of the field-to-trace attenuation and the conducted immunity of the IC, thus neglecting the radiated immunity of the IC. As far as could be measured, the prediction correlated well with measurement, so the dominant-conduction hypothesis was not falsified with this case study. |
| Databáze: | OpenAIRE |
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