Optical transceiver ICs based on 3D die-stacking of opto-electronic devices

Autor:	Karel van de Plassche, H.J.S. Dorren, Pinxiang Duan, Oded Raz, Barry Smalbrugge
Přispěvatelé:	Electro-Optical Communication, Low Latency Interconnect Networks, NanoLab@TU/e
Jazyk:	angličtina
Rok vydání:	2013
Předmět:	Materials science business.industry Transmitter Stacking Electrical engineering Integrated circuit Optical switch Die (integrated circuit) law.invention Transmission (telecommunications) law Optoelectronics Modal dispersion Transceiver business
Zdroj:	Proceedings of the 2013 IEEE Photonics Conference (IPC), 8-12 September 2013, Bellevue, Washington, 515-516 STARTPAGE=515;ENDPAGE=516;TITLE=Proceedings of the 2013 IEEE Photonics Conference (IPC), 8-12 September 2013, Bellevue, Washington
Popis:	We review a wafer-scale process for making compact 3D stacked transmitter and receivers ICs. We show experimental results that indicate that error-free operation of the transmitter at 10 Gbps can be obtained over 500m transmission through OM4-Plus fiber.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e40444a582d8c3f285c6145a8ecace0a https://research.tue.nl/nl/publications/2b306a13-7b58-49d9-842f-420ee1e171a5 Zobrazit plný text záznamu