Experimental investigation and computer simulation of thermal behaviour of wallboards containing a phase change material
Autor: | Daniel Quenard, Hébert Sallée, André Bontemps, Maha Ahmad |
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Přispěvatelé: | Centre Scientifique et Technique du Bâtiment (CSTB), Laboratoire des Écoulements Géophysiques et Industriels [Grenoble] (LEGI), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS)-Université Joseph Fourier - Grenoble 1 (UJF) |
Rok vydání: | 2006 |
Předmět: |
Vacuum insulated panel
Engineering Light envelope 020209 energy 0211 other engineering and technologies 02 engineering and technology Polyethylene glycol Latent heat storage Thermal energy storage chemistry.chemical_compound 021105 building & construction Thermal 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Composite material Polycarbonate Envelope (mathematics) Wallboard Civil and Structural Engineering Computer simulation Waste management business.industry Mechanical Engineering Building and Construction Phase-change material VIP chemistry PCM visual_art [SPI.MECA.THER]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Thermics [physics.class-ph] visual_art.visual_art_medium Wallboard Light envelope business Phase change material [SPI.GCIV.EC]Engineering Sciences [physics]/Civil Engineering/Eco-conception |
Zdroj: | Energy and Buildings Energy and Buildings, Elsevier, 2005, 38 (4), pp.357-366. ⟨10.1016/j.enbuild.2005.07.008⟩ |
ISSN: | 0378-7788 |
DOI: | 10.1016/j.enbuild.2005.07.008 |
Popis: | International audience; In the objective to define passive components for the light envelope of buildings, different types of wallboards containing a phase change material (PCM) were studied. The high storage capacity should enable the overall thickness of wallboards to be less than 5 cm. To lower the investment costs, the wallboards were made from commercial panels after a first attempt of using gypsum walls. Three types of wallboards were studied: (i) a polycarbonate panel filled with paraffin granulates; (ii) a polycarbonate panel filled with polyethylene glycol PEG 600; (iii) a PVC panel filled with PEG 600 and coupled to a VIP. An experimental set-up was built to determine the thermal response of these wallboards to thermal solicitations. Experimental results were compared to those obtained by a numerical simulation in which an apparent heat capacity method was used. The final results show that the last studied wallboard could be used in the test cells under construction and then validate the concept. |
Databáze: | OpenAIRE |
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