Chemical and Physical Characteristics
| Autor: | Jennie S. Hwang |
|---|---|
| Rok vydání: | 1992 |
| Předmět: | |
| Zdroj: | Solder Paste in Electronics Packaging ISBN: 9780442013530 Solder Paste in Electronics Packaging ISBN: 9789401160520 |
| DOI: | 10.1007/978-1-4615-3528-7_3 |
| Popis: | Regarding chemical and physical characteristics of solder paste, the coverage in certain areas is inevitably discussed in general terms in order to avoid proprietary information. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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