The formation of copper sulphide semiconductors inside Langmuir-Blodgett films of Cu(II) ion complexes
| Autor: | A.J. Schouten, P.J Werkman, R.H Wieringa |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 1998 |
| Předmět: |
Inorganic chemistry
Langmuir-Blodgett film chemistry.chemical_element Langmuir–Blodgett film Metal STEARATE X-ray photoelectron spectroscopy Monolayer SULFIDE Materials Chemistry PARTICLES PLATINUM multilayer PALLADIUM Bilayer copper sulphide Metals and Alloys MONOLAYERS Surfaces and Interfaces semiconductor Copper Surfaces Coatings and Films Electronic Optical and Magnetic Materials Crystallography chemistry visual_art METAL RAY PHOTOELECTRON-SPECTROSCOPY visual_art.visual_art_medium Platinum CLUSTERS Stoichiometry |
| Zdroj: | Thin Solid Films, 323(1-2), 251-256. Elsevier Science |
| ISSN: | 0040-6090 |
| Popis: | The fabrication of layers of copper sulphide within multilayers of copper complexes of the amphiphile 4-(10,12-pentacosadiynamido methyl)pyridine, by diffusion of H2S into the multilayers, was studied by W-VIS spectroscopy. XPS measurements revealed that copper sulphides can be synthesised which differ in stoichiometry when multilayers are used, which were built up from different subphases (CuCl2 or Cu(ClO4)(2)). The distinct layer pattern of the Langmuir-Blodgett (LB) films is preserved during the formation of the copper sulphide layers and the bilayer distance increases slightly by about 1.8 Angstrom for the multilayers built up from a 5 mM CuCl2 subphase, whereas for the multilayers built up from a 5 mM Cu(ClO4)(2) subphase the bilayer distance decreases a little by about 0.6 Angstrom after the formation of copper sulphide inside these LB films. After polymerisation the multilayer structure is destroyed in the case of LB films built up from the CuCl2 subphase, whereas the layer structure is preserved during the polymerisation process in the case of multilayers built up from a 5 mM Cu(ClO4)(2) subphase. (C) 1998 Elsevier Science S.A. All rights reserved. |
| Databáze: | OpenAIRE |
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