Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

Autor: Horagodage Prabhath Jeewan, Takeshi Kawano, Kenji Okabe, Ippei Akita, Makoto Ishida, Shota Yamagiwa
Jazyk: angličtina
Rok vydání: 2015
Předmět:
Zdroj: Sensors
Volume 15
Issue 12
Pages 31821-31832
Sensors, Vol 15, Iss 12, Pp 31821-31832 (2015)
Sensors (Basel, Switzerland)
Sensors; Volume 15; Issue 12; Pages: 31821-31832
ISSN: 1424-8220
DOI: 10.3390/s151229885
Popis: In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.
Databáze: OpenAIRE