Effects of reducing light-curing time of a high-power LED device on shear bond strength of brackets

Autor: Lídia Parsekian Martins, Layene Figueiredo Almeida, Renato Parsekian Martins
Přispěvatelé: Universidade Estadual Paulista (Unesp)
Rok vydání: 2018
Předmět:
Zdroj: Web of Science
Repositório Institucional da UNESP
Universidade Estadual Paulista (UNESP)
instacron:UNESP
ISSN: 1615-6714
1434-5293
Popis: Made available in DSpace on 2018-11-26T17:55:02Z (GMT). No. of bitstreams: 0 Previous issue date: 2018-09-01 Purpose To assess the effects of reducing the curing time of a high-power light-emitting diode (LED) unit (Valo, Ultradent, South Jordan, UT, USA) on shear bond strength (SBS) of metal brackets and on the amount of adhesive remnant of two orthodontic composites. Methods Eighty human premolars were divided into four groups (G1-4) according to curing time and composite: G1 (Transbond XT, 6s), G2 (Opal Bond MV, 6s), G3 (Transbond XT, 3s), and G4 (Opal Bond MV, 3s). Twenty-four hours after bonding, brackets were subject to a SBS test performed with a universal testing machine. Enamel surface was analyzed by SEM and the amount of adhesive remnant was assessed by the Image J software area calculation tool. Two-way analysis of variance was used for statistical analysis of SBS data, while Friedman and Mann-Whitney post hoc tests were used to analyze data on the amount of adhesive remnant. Results Time and composite significantly affected SBS (p
Databáze: OpenAIRE