Advancing the ion beam thin film planarization process for the smoothing of substrate particles

Autor: Ted Liang, Paul B. Mirkarimi, D. G. Stearns, Farhad Salmassi, Eberhard Spiller, Jeff C. Robinson, Alan R. Stivers, James Alexander Liddle, Sherry L. Baker
Rok vydání: 2005
Předmět:
Zdroj: Mirkarimi, P.; Spiller, E.; Baker, S.; Robinson, J.; Stearns, D.; Liddle, J.A.; et al.(2004). Advancing the ion beam thin film planarization process for the smoothing of substrate particles. Microelectronic Engineering, 77(3/4/2008). Lawrence Berkeley National Laboratory: Lawrence Berkeley National Laboratory. Retrieved from: http://www.escholarship.org/uc/item/7sq7q296
ISSN: 0167-9317
DOI: 10.1016/j.mee.2004.12.098
Popis: For a number of technologies small substrate contaminants are undesirable, and for one technology in particular, extreme ultraviolet lithography (EUVL), they can be a very serious issue. We have demonstrated that the Ion Beam Thin Film Planarization Process, a coating process designed to planarize substrate asperities, can be extended to smooth ~70 and ~80nm diameter particles on EUVL reticle substrates to a height of ~0.5nm, which will render them noncritical in an EUVL printing process. We demonstrate this smoothing process using controlled nanoscale substrate particles and lines fabricated with an e-beam lithography process. The above smoothing process was also modified to yield an excellent reflectance/wavelength uniformity and a good EUV reflectivity for the multilayer, which is required for EUVL reticles. XTEM on a smoothed substrate line defect shows excellent agreement with results obtained from our multilayer growth model.
Databáze: OpenAIRE