| Autor: |
Vaclav Smitka, Jiri Navratil, Ales Hamacek, Tomas Rericha |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 42nd International Spring Seminar on Electronics Technology (ISSE). |
| DOI: |
10.1109/isse.2019.8810265 |
| Popis: |
This paper presents interconnecting of printed electronics patterns by printing technologies or non-conductive adhesives (NCA). DuPont Kapton and glass substrate, Aerosol Jet nanoparticle silver ink and UV curable NCA were used. The aim of the research is to create a reliable interconnection for double sided printed electronics attached to rigid substrate while using printing technologies and adhesives. The printing technology is used for printing on 3D structure and also for printing micro 3D structures due to lowering the contact resistance of NCA attached side. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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