Modelling and analysis of the stress distribution in a multi-thin film system Pt/USG/Si
| Autor: | P. Gardes, F. Roqueta, J. C. Craveur, Abdellah Tougui, Soufyane Belhenini, Wei-Zhen Yao |
|---|---|
| Přispěvatelé: | Mécanique des Matériaux et Procédés (MMP), Laboratoire de Mécanique Gabriel Lamé (LaMé), Université d'Orléans (UO)-Université de Tours-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université d'Orléans (UO)-Université de Tours-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA), STMicroelectronics [Tours] (ST-TOURS), Université d'Orléans (UO)-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours (UT)-Université d'Orléans (UO)-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours (UT) |
| Jazyk: | angličtina |
| Rok vydání: | 2018 |
| Předmět: |
Materials science
Polymers and Plastics 020209 energy 02 engineering and technology Residual Curvature Biomaterials Stress (mechanics) [PHYS.MECA.MEMA]Physics [physics]/Mechanics [physics]/Mechanics of materials [physics.class-ph] [PHYS.MECA.STRU]Physics [physics]/Mechanics [physics]/Structural mechanics [physics.class-ph] Stack (abstract data type) Residual stress [PHYS.MECA.SOLID]Physics [physics]/Mechanics [physics]/Solid mechanics [physics.class-ph] 0202 electrical engineering electronic engineering information engineering Microelectronics Thin film Composite material ComputingMilieux_MISCELLANEOUS business.industry Metals and Alloys [PHYS.MECA.MSMECA]Physics [physics]/Mechanics [physics]/Materials and structures in mechanics [physics.class-ph] 021001 nanoscience & nanotechnology Finite element method Surfaces Coatings and Films Electronic Optical and Magnetic Materials 0210 nano-technology business |
| Zdroj: | Materials Research Express Materials Research Express, IOP Publishing Ltd, 2018, 5 (4), pp.046405. ⟨10.1088/2053-1591/aaba4b⟩ |
| ISSN: | 2053-1591 |
| Popis: | Residual stress analysis is commonly achieved through curvature measurement with the help of Stoney's formula. However, this conventional approach is inadequate for multi-layer thin film systems, which are widely used in today's microelectronics. Also, for the thin film case, the residual stress is composed of thermal stress and intrinsic stress. Measuring the wafer curvature at room temperature provides a value for the average stresses in the layer, the two components cannot be distinguished by the existing methodologies of curvature measurement. To alleviate these problems, a modified curvature method combining finite element (FE) modelling is proposed to study the stress distribution in a Pt/USG/Si structure. A 2D FE model is firstly built in order to calculate the thermal stress in the multilayer structure, the obtained thermal stresses in respective films are verified by an analytical model. Then, we calculate the warpage of the multilayer structure by considering the intrinsic stress in the respective films. The residual stresses in the films are determined by minimizing the difference between the simulated warpage and that of experimental measurement. The proposed approach can be used to calculate not only the average residual stress but also thermal and intrinsic stress components in the USG and Platinum films. The obtained residual and intrinsic stresses from a numerical model are compared with the values of other studies. There is no limitation for the application of our methodologies regarding the number of the layers in the stack. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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