Effect of Electrical Contact on the Contact Residual Stress of a Microrelay Switch
| Autor: | Yung-Chuan Chen, Hsun-Heng Tsai, Li-Wen Chen, Wei-Hua Lu |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2007 |
| Předmět: |
Materials science
lcsh:Chemical technology Biochemistry Full Research Paper Analytical Chemistry Contact force Residual stress Plating Coupling (piping) lcsh:TP1-1185 Electrical and Electronic Engineering Composite material Instrumentation electrical contact business.industry elastic-plastic finite element model Microrelay Structural engineering Atomic and Molecular Physics and Optics Finite element method Electrical contacts thermal-electrical coupling Electrode thermal-stress coupling business Beam (structure) |
| Zdroj: | Sensors Volume 7 Issue 11 Pages: 2997-3011 Sensors, Vol 7, Iss 11, Pp 2997-3011 (2007) Sensors (Basel, Switzerland) |
| ISSN: | 1424-8220 |
| DOI: | 10.3390/s7112997 |
| Popis: | This paper investigates the effect of electrical contact on the thermal contact stress of a microrelay switch. A three-dimensional elastic-plastic finite element model with contact elements is used to simulate the contact behavior between the microcantilever beam and the electrode. A model with thermal-electrical coupling and thermal-stress coupling is used in the finite element analysis. The effects of contact gap, plating film thickness and number of switching cycles on the contact residual stress, contact force, plastic deformation, and temperature rise of the microrelay switch are explored. The numerical results indicate that the residual stress increases with increasing contact gap or decreasing plating film thickness. The results also show that the residual stress increases as the number of switching cycles increases. A large residual stress inside the microcantilever beam can decrease the lifecycle of the microrelay. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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