Harboring Contaminants in Repeatedly Reprocessed Pedicle Screws
Autor: | Jeffrey C. Wang, Neel Anand, Aakash Agarwal, Anand K. Agarwal, Steve Garfin, Christian Schultz |
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Jazyk: | angličtina |
Rok vydání: | 2018 |
Předmět: |
030222 orthopedics
preoperative implant handling sterile processing department business.industry SSI Dentistry Original Articles implant exposure surgical site infection 03 medical and health sciences 0302 clinical medicine terminally sterile devices Medicine Orthopedics and Sports Medicine Surgery Neurology (clinical) SPD business Pedicle screw Surgical site infection 030217 neurology & neurosurgery |
Zdroj: | Global Spine Journal |
ISSN: | 2192-5690 2192-5682 |
Popis: | Study Design: It consisted of evaluation of the pedicle screws for presence of residual nonmicrobial contaminants and tabulation of the minimum steps and time required for reprocessing implants as per guidelines and its comparison with actual practice. Objective: An evaluation of the nonmicrobial contaminants prevalent on the pedicle screws used for spine surgery and the underlying practice cause behind the source. Methods: The first component consisted of a random selection of 6 pedicle screws and its assessment using optical microscopy, scanning electron microscopy with energy dispersive spectroscopy, and Fourier transform infrared spectroscopy. The second component consisted of review of implant reprocessing guidelines and its applicability. Results: Three types of contaminants were identified: corrosion, saccharide of unknown origin, and soap residue mixed with and were mostly present at the interfaces with low permeability. In addition, manufacturer’s guideline recommends 19 hours of reprocessing, whereas the real-time observation revealed a turnaround time of 1 hour 17 minutes. Conclusion: Repeatedly reprocessed pedicle screws host corrosion, carbohydrate, fat, and soap, which could be a cause of surgical site infection and inflammatory responses postsurgery. The cause behind it is the impracticality of repeated cleaning and inspection of such devices. |
Databáze: | OpenAIRE |
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