Pulse Electroplating of Ni-W Alloy for the Diffusion Barrier in Under Bump Metallurgy
| Autor: | Jae-Ho Lee, Seo-Hyang Lee |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Materials science Diffusion barrier Metallurgy Shear force Alloy Biomedical Engineering Intermetallic Bioengineering 02 engineering and technology General Chemistry engineering.material 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Hardness Coating Plating 0103 physical sciences engineering General Materials Science 0210 nano-technology Electroplating |
| Zdroj: | Journal of nanoscience and nanotechnology. 21(5) |
| ISSN: | 1533-4899 |
| Popis: | Ni–W alloy was electroplated from citrate bath. The crack-free coatings were obtained using the pulse electroplating method. The surface hardness was increased up to 700 Hv and it is twice as high than that of the electroplated Ni. The surface hardness was increased as the content of W in the coating increased. However, the higher W contents made surface cracks and the surface hardness was decreased. Ni–W alloy made less intermetallic components (IMC) and the shear force of solder ball was increased as much as 20% compared with conventional Ni plating. |
| Databáze: | OpenAIRE |
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