Thermal Dynamics Effects using Pulse-Shaping Laser Sintering of Printed Silver Inks
Autor: | Charles Trudeau, Patrick Beaupré, Sylvain G. Cloutier, Pierre Galarneau, Martin Bolduc |
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Jazyk: | angličtina |
Rok vydání: | 2018 |
Předmět: |
Fabrication
Materials science Sintering lcsh:Medicine 02 engineering and technology 010402 general chemistry 01 natural sciences Article law.invention law Electronics lcsh:Science Sheet resistance Electronic circuit Multidisciplinary business.industry lcsh:R 021001 nanoscience & nanotechnology Laser Pulse shaping 0104 chemical sciences Selective laser sintering Optoelectronics lcsh:Q 0210 nano-technology business |
Zdroj: | Scientific Reports, Vol 8, Iss 1, Pp 1-9 (2018) Scientific Reports |
ISSN: | 2045-2322 |
DOI: | 10.1038/s41598-018-19801-4 |
Popis: | In recent years, additive manufacturing has been evolving towards flexible substrates for the fabrication of printable electronic devices and circuits. Generally polymer-based, these emerging substrates suffer from their heat sensitivity and low glass-transition temperatures. As such they require new highly-localized sintering processes to treat the electronic inks without damaging the polymer-based substrate. Laser-based sintering techniques have shown great promises to achieve high-quality sintering locally, while controlling the heat penetration to preserve the polymer substrates integrity. In this report, we explore new optimization pathways for dynamic laser-based sintering of conductive silver inks. Multiple passes of a pulsed laser are first performed while varying pulse train frequencies and pulse energies as an attempt to optimize the properties of the silver inks. Then, time-domain pulse shaping is performed to alter the properties of the conductive inks. Together, these pathways allow for the careful control of the time-domain laser energy distribution in order to achieve the best electronic performances while preserving the substrate’s integrity. Sheet resistance values as low as 0.024Ω/□ are achieved, which is comparable to conventional 1-hour oven annealing, with the processing time dramatically reduced to the milisecond range. These results are supported by finite element modeling of the laser-induced thermal dynamics. |
Databáze: | OpenAIRE |
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