Photonic Integrated Circuits for NGPON2 ONU Transceivers (Invited)
| Autor: | Antônio Lúcio Teixeira, Claudio Rodrigues, C. A. G. Rodrigues, Cátia Pinho, A. Tavares, Francisco Rodrigues |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2020 |
| Předmět: |
next-generation passive optical network 2 (NGPON2)
Computer science Context (language use) 02 engineering and technology 01 natural sciences Passive optical network lcsh:Technology 010309 optics high-speed PON (HSP) lcsh:Chemistry 020210 optoelectronics & photonics 0103 physical sciences 0202 electrical engineering electronic engineering information engineering General Materials Science Optical network unit passive optical network (PON) Instrumentation lcsh:QH301-705.5 Fluid Flow and Transfer Processes Mass market Access network lcsh:T Process Chemistry and Technology Photonic integrated circuit photonic integrated circuits (PIC) General Engineering lcsh:QC1-999 Computer Science Applications Computer architecture lcsh:Biology (General) lcsh:QD1-999 access networks lcsh:TA1-2040 Key (cryptography) Transceiver lcsh:Engineering (General). Civil engineering (General) super-PON lcsh:Physics |
| Zdroj: | Applied Sciences, Vol 10, Iss 4024, p 4024 (2020) |
| ISSN: | 2076-3417 |
| Popis: | The development of photonic integrated circuits (PIC) for access network applications, such as passive optical networks (PON), constitutes a very attractive ecosystem due to PON’s potential mass market. The implementation of PIC solutions in this context is expected to facilitate the possibility of increasing the complexity and functionalities of devices at a potentially lower cost. We present a review addressing the prominent access network market requirements and the main restrictions stemming from its specific field of application. Higher focus is given to PON devices for the optical network unit (ONU) and the implications of designing a device ready for market by discussing its various perspectives in terms of technology and cost. The discussed PIC solutions/approaches in this paper are mainly based on indium phosphide (InP) technology, due to its monolithic integration capabilities. A comprehensive set of guidelines considering the current technology limitations, benefits, and processes are presented. Additionally, key current approaches and efforts are analyzed for PON next generations, such as next-generation PON 2 (NGPON2) and high-speed PON (HSP). |
| Databáze: | OpenAIRE |
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