ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints
| Autor: | Guanghua Wu, Meixian Jiang, Diganta Das, Michael Pecht |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Materials science
General Computer Science General Engineering Anisotropic conductive adhesive Curing time ACA Interfacial shear parameters optimization General Materials Science shear strength lcsh:Electrical engineering. Electronics. Nuclear engineering Composite material Curing degree lcsh:TK1-9971 Curing (chemistry) |
| Zdroj: | IEEE Access, Vol 7, Pp 182906-182915 (2019) |
| ISSN: | 2169-3536 |
| DOI: | 10.1109/access.2019.2959324 |
| Popis: | This paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections. The curing kinetics of ACA is first presented and then a curing degree $(\alpha)$ relationship between curing temperature $T$ and curing time $t$ is established. The influence of different curing degree states on the interfacial shear strength is then reported, including the effect of degree of curing on shear strength both before and after hygro-thermal aging. |
| Databáze: | OpenAIRE |
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