X-Ray Imaging and Computed Tomography for Engineering Applications
Autor: | Michael Maisl, Christian Fella, Simon Zabler, Peter Hornberger, Randolf Hanke, Jochen Hiller |
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Přispěvatelé: | Publica |
Jazyk: | angličtina |
Rok vydání: | 2021 |
Předmět: |
Materials science
CT metrology Computed tomography 02 engineering and technology 01 natural sciences Materialcharakterisierung Nuclear magnetic resonance dimensional measurements Nondestructive testing 0103 physical sciences medicine Electrical and Electronic Engineering Röntgenbildgebung Instrumentation materials characterization 010302 applied physics Metrologie medicine.diagnostic_test business.industry X-ray imaging X-ray non-destructive testing In-situ computed tomography Dimensionelles Messen 021001 nanoscience & nanotechnology in situ CT zerstörungsfreie Prüfung 0210 nano-technology business Computertomografie |
Popis: | After an incremental development which took place over four decades, X-ray imaging has become an important tool for non-destructive testing and evaluation. Computed Tomography (CT) in particular beholds the power of determining the location of flaws and inclusions (e. g. in castings and composites) in three-dimensional object coordinates. Therefore, and thanks to a speed-up of the measurement, CT is now routinely considered for in-line inspection of electronics, castings and composites. When precision and not speed is important, Micro-CT (μCT) can be employed for Dimensional Measurements (DM, e. g. quality assurance and shape verification), as well as for in situ testing, and for characterizing micro-structures in metals and composites. Using appropriate image processing and analysis μCT can determine the local fibre orientation in composites, the granular morphology of battery cathodes or the inter-connectivity of certain phases in casting alloys. Today, the large variety of X-ray instruments and methods poses an application problem which requires experience and a lot of knowledge for deciding which technique applies best to the task at hand. Application-specific guidelines exist for X-ray radiography testing (RT) only, whereas standardization has been applied to CT, unfortunately leaving out high resolution sub μ CT, and nano-CT. For the latter exist an equally high number of NDT applications, however these instruments still necessitate a profound expertise. The task is to identify key industrial applications and push CT from system standardization to application specific automation. |
Databáze: | OpenAIRE |
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