Effect of Inlet Subcooling on Flow Boiling Behaviour of HFE-7200 in a Microchannel Heat Sink

Autor:	Gary Henderson, Tassos G. Karayiannis, Vivian Y.S. Lee
Přispěvatelé:	Wen, C, Yan, Y
Rok vydání:	2021
Předmět:	Microchannel heat sink geography Materials science geography.geographical_feature_category Nuclear engineering Hardware_PERFORMANCEANDRELIABILITY Dissipation Inlet Power (physics) Subcooling Thermal Hardware_INTEGRATEDCIRCUITS Electronics Flow boiling
Zdroj:	Advances in Heat Transfer and Thermal Engineering ISBN: 9789813347649
DOI:	10.1007/978-981-33-4765-6_15
Popis:	Miniaturised electronics pose challenging thermal demands, not only at chip-level power dissipation but also at the complete system-level heat rejection, in modern electronic packages. Chip-level power densities are projected to be as high as 4.5 MW/m2 in computer systems by 2026.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cbec610d75cadd92ed9d37d12178c2f8 https://doi.org/10.1007/978-981-33-4765-6_15 Zobrazit plný text záznamu