Microstructural behaviour of solder alloys

Autor:	Ubachs, R.L.J.M., Schreurs, P.J.G., Geers, M.G.D., Ernst, L.J., Zhang, G.Q., Rodgers, P., Saint Leger, O
Přispěvatelé:	Mechanics of Materials, Processing and Performance, Mechanical Engineering, Group Geers
Rok vydání:	2004
Předmět:	Materials science Viscoplasticity Creep Field (physics) Soldering Phase (matter) Metallurgy Composite material Microstructure Mass fraction Thermal expansion
Zdroj:	Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium, 543-547 STARTPAGE=543;ENDPAGE=547;TITLE=Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
DOI:	10.1109/esime.2004.1304089
Popis:	In this contribution a strongly nonlocal diffuse interface theory is used to model the microstructure evolution of a multiphase solder alloy. The mechanical behaviour of the material is modelled using a hyperelasto-viscoplastic Perzyna model. The material parameters are taken dependent on the mass fraction field which is calculated with the diffuse interface model. This results in a microstructure dependent material model which takes into account the size, orientation, and distribution of the individual phase regions.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cbda1ec6091374a8ee952ec64891c1c3 https://doi.org/10.1109/esime.2004.1304089 Zobrazit plný text záznamu