| Popis: |
Membrane-templated deformable carrier and elastomeric encapsulant enable flexible semiconductor package in support of the demands of wearables and flexible electronic gadgets. The selectively pore-filled membrane, with metal particle suspension, is mechanically reinforced by a thin elastomeric material layer to protect the newly formed leads, and to give structure to withstand package assembly. Package assembly is achieved by attaching a silicon die via a die attach process, electrically connecting the silicon to the carrier via wirebonding, and encapsulating the package using an elastomeric material via elastomeric molding process. The elastomeric support is then peeled off, exposing the terminal surface of the leads. The deformable carrier and the elastomeric encapsulant ensure package flexibility and conformity to distortion |
