Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials
| Autor: | Qing Lin, Zheng Yan, Dapeng Ou, Fu Haoran, Yuming Huang, Xuelin Guo, Jung Hwan Kim, Kewang Nan, An Zhao, Philipp Gutruf, Keh Chih Hwang, Yihui Zhang, Yitao Qiu, Fan Zhang, Zhaoqian Xie, John A. Rogers, Hongying Luo, Mengdi Han, Fei Liu, Yonggang Huang, Jeonghyun Kim, Yuhao Liu, Mingye Gao |
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| Rok vydání: | 2016 |
| Předmět: |
3D Assembly
Fabrication near field communication Nanotechnology 02 engineering and technology 010402 general chemistry Network topology 01 natural sciences Engineering Planar Microsystem buckling Research Articles microfabrication Multidisciplinary multilayer business.industry SciAdv r-articles 021001 nanoscience & nanotechnology 0104 chemical sciences Semiconductor Structural stability Compatibility (mechanics) 0210 nano-technology business Research Article Microfabrication |
| Zdroj: | Science Advances |
| ISSN: | 2375-2548 |
| DOI: | 10.1126/sciadv.1601014 |
| Popis: | Buckling-driven assembly of 3D mesostructures from releasable multilayers offers versatile design options for unique applications. Capabilities for assembly of three-dimensional (3D) micro/nanostructures in advanced materials have important implications across a broad range of application areas, reaching nearly every class of microsystem technology. Approaches that rely on the controlled, compressive buckling of 2D precursors are promising because of their demonstrated compatibility with the most sophisticated planar technologies, where materials include inorganic semiconductors, polymers, metals, and various heterogeneous combinations, spanning length scales from submicrometer to centimeter dimensions. We introduce a set of fabrication techniques and design concepts that bypass certain constraints set by the underlying physics and geometrical properties of the assembly processes associated with the original versions of these methods. In particular, the use of releasable, multilayer 2D precursors provides access to complex 3D topologies, including dense architectures with nested layouts, controlled points of entanglement, and other previously unobtainable layouts. Furthermore, the simultaneous, coordinated assembly of additional structures can enhance the structural stability and drive the motion of extended features in these systems. The resulting 3D mesostructures, demonstrated in a diverse set of more than 40 different examples with feature sizes from micrometers to centimeters, offer unique possibilities in device design. A 3D spiral inductor for near-field communication represents an example where these ideas enable enhanced quality (Q) factors and broader working angles compared to those of conventional 2D counterparts. |
| Databáze: | OpenAIRE |
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