Copper Plating on Resistive Substrates, Diffusion Barrier and Alternative Seed Layers

Autor:	Magi Margalit Nagar, Silvia Armini, Philippe M. Vereecken, Wouter Ruythooren, Katrien Strubbe, Aleksandar Radisic, Zaid El-Mekki, Henny Volders
Rok vydání:	2010
Předmět:	Materials science Diffusion barrier Inorganic chemistry Alloy Tantalum chemistry.chemical_element engineering.material Copper chemistry Plating engineering Copper plating Cyclic voltammetry Cobalt
Zdroj:	ECS Transactions. 25:175-184
ISSN:	1938-6737 1938-5862
DOI:	10.1149/1.3318516
Popis:	We have studied electrochemical deposition of copper on ruthenium-tantalum (Ru-Ta) alloy, tantalum (Ta), and cobalt (Co) substrates using cyclic voltammetry and galvanostatic methods. We show that a single-step direct-plating from acidic Cu bath approach is favorable on thin Ru-Ta films, while it presents a significant challenge for plating on resistive Ta and Co substrates.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ca8192ff0c9d9e5717c4a228a218196b https://doi.org/10.1149/1.3318516 Zobrazit plný text záznamu