First demonstration of a new additive manufacturing process based on metal extrusion and solid-state bonding
Autor: | Martin Steinert, Torgeir Welo, Jørgen Blindheim |
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Rok vydání: | 2019 |
Předmět: |
Materials science
business.product_category Mechanical Engineering Plastics extrusion Process (computing) 02 engineering and technology Die swell Substrate (printing) Raw material 021001 nanoscience & nanotechnology Industrial and Manufacturing Engineering Computer Science Applications 020303 mechanical engineering & transports 0203 mechanical engineering Control and Systems Engineering Die (manufacturing) Deposition (phase transition) Extrusion Composite material 0210 nano-technology business Software |
Zdroj: | The International Journal of Advanced Manufacturing Technology |
ISSN: | 1433-3015 0268-3768 |
Popis: | In this paper, a new additive manufacturing (AM) process based on extrusion and solid-state bonding is presented. The process uses metal feedstock wire which is processed in a continuous rotary extruder in order to disperse the surface oxides of the feedstock and to provide the required bonding pressure. Simultaneously, the die outlet is scraping the contact surface to provide an oxide-free interface between the extrudate and the substrate. Optical analyses of samples from a layered structure produced from AA6082 reveal that the stringers are fully merged; however, some voids and cracks are observed between the individual stringers. Still, this initial demonstration indicates that the process, upon further development, has high potential of producing near-net-shape parts at high deposition rates. Open Access This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http:// creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. |
Databáze: | OpenAIRE |
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