Zero-Level Packaged RF-MEMS Switched Capacitors on Glass Substrates
| Autor: | Clement Hallepee, Nesrine Belkadi, Kevin Nadaud, Damien Passerieux, Pierre Blondy |
|---|---|
| Přispěvatelé: | Franche-Comté Électronique Mécanique, Thermique et Optique - Sciences et Technologies (UMR 6174) (FEMTO-ST), Université de Technologie de Belfort-Montbeliard (UTBM)-Ecole Nationale Supérieure de Mécanique et des Microtechniques (ENSMM)-Université de Franche-Comté (UFC), Université Bourgogne Franche-Comté [COMUE] (UBFC)-Université Bourgogne Franche-Comté [COMUE] (UBFC)-Centre National de la Recherche Scientifique (CNRS), XLIM (XLIM), Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS), GREMAN (matériaux, microélectronique, acoustique et nanotechnologies) (GREMAN - UMR 7347), Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours (UT)-Centre National de la Recherche Scientifique (CNRS), MINACOM, Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS)-Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS), MINACOM (XLIM-MINACOM), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours-Centre National de la Recherche Scientifique (CNRS) |
| Jazyk: | angličtina |
| Rok vydání: | 2020 |
| Předmět: |
Microelectromechanical systems
Materials science Passivation business.industry Mechanical Engineering 020206 networking & telecommunications 02 engineering and technology Nitride 021001 nanoscience & nanotechnology law.invention [SPI.TRON]Engineering Sciences [physics]/Electronics chemistry.chemical_compound Capacitor Silicon nitride chemistry Plasma-enhanced chemical vapor deposition law 0202 electrical engineering electronic engineering information engineering Optoelectronics Electrical and Electronic Engineering Thin film 0210 nano-technology business Layer (electronics) ComputingMilieux_MISCELLANEOUS |
| Zdroj: | Journal of Microelectromechanical Systems Journal of Microelectromechanical Systems, Institute of Electrical and Electronics Engineers, 2020, 29 (1), pp.109-116. ⟨10.1109/JMEMS.2019.2949949⟩ |
| ISSN: | 1057-7157 |
| Popis: | This article presents the design, realization and measurement of thin-film packaged RF-MEMS switched capacitors for millimeter-wave applications. Packaging is included in the MEMS fabrication process, with silicon nitride thin film shell above MEMS structure. Thin-film packaging is done using a combination of electron beam evaporated metal and silicon nitride PECVD deposition. The package hermeticity has been evaluated after the first metal sealing layer deposition, indicating that the protective nitride shells are hermetic enough before the final PECVD passivation. The devices have been fabricated on glass substrates, allowing for further combination with low loss, millimeter-wave passive circuits. The MEMS capacitors are actuated by deflecting thin gold metal membrane towards the package dielectric layer, increasing the capacitance by a factor 3, from 25 fF to 75 fF. The device size, including its hermetic packaging, is $70\times 50\,\,\mu \text{m}^{\mathbf {2}}$ . Reliability has been evaluated, through 12-hour hold-down test measurements. [2019-0060] |
| Databáze: | OpenAIRE |
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