Novel method of alignment to buried cavities in cavity-SOI wafers for advanced MEMS devices
| Autor: | Lijc Lambert Bergers, Christopher Mountain, Marta Kluba, Jaap Snijder, Ronald Dekker |
|---|---|
| Přispěvatelé: | Mechanics of Materials |
| Jazyk: | angličtina |
| Rok vydání: | 2019 |
| Předmět: |
Offset (computer science)
Lithography Computer science Silicon on insulator lcsh:TK7800-8360 Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology 01 natural sciences C-SOI Software Alignment marker Cavity-SOI lcsh:Technology (General) Electronic engineering Hardware_INTEGRATEDCIRCUITS Wafer Electrical and Electronic Engineering Stepper Wafer stepper Alignment Microelectromechanical systems business.industry 010401 analytical chemistry lcsh:Electronics 021001 nanoscience & nanotechnology Condensed Matter Physics Atomic and Molecular Physics and Optics 0104 chemical sciences Surfaces Coatings and Films Electronic Optical and Magnetic Materials MEMS lcsh:T1-995 0210 nano-technology business Microfabrication |
| Zdroj: | Micro and Nano Engineering, Vol 5, Iss, Pp-(2019) Micro and Nano Engineering, 5:100043. Elsevier Micro and Nano Engineering, 5 Micro and Nano Engineering |
| ISSN: | 2590-0072 |
| Popis: | Accurate alignment between the cavities in cavity-SOI (c-SOI) wafers and lithography on the wafer surface is essential to advanced MEMS production. Existing alignment methods are well defined, but often require specialized equipment or costly software packages available only in professional manufacturing environments. It would be beneficial for the microfabrication world to be able to utilize standard alignment techniques and tools that are easily available also in smaller MEMS fabrication units and especially the majority of research facilities. Therefore, we demonstrate a feasible method for c-SOI wafer alignment using an ASML PAS5500/100 wafer stepper with standard software configuration by relocating ASML alignment markers towards wafer's edges and utilizing a terracing process to reveal them for alignment. Moreover, we characterize the magnitude and behavior of image offset errors that are introduced using this method. The offset error is found to be inversely proportional to the value of the coordinate in each axis, resulting in images being shifted towards the center of the wafer. The measured offset errors are |
| Databáze: | OpenAIRE |
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