Performance and Characterization of New Micromachined High-Frequency Linear Arrays
| Autor: | Emmanuel Cherin, F.S. Foster, Marc Lukacs, Ross Williams, James Mehi, Jianlma Yin, R.C. Garcia, Guofeng Pang |
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| Rok vydání: | 2006 |
| Předmět: |
Engineering
Acoustics and Ultrasonics Radio Waves Transducers Sensitivity and Specificity Directivity Printed circuit board Optics Image Interpretation Computer-Assisted Focal length Electrical and Electronic Engineering Center frequency Instrumentation Ultrasonography Miniaturization business.industry Bandwidth (signal processing) Reproducibility of Results Equipment Design Image Enhancement Equipment Failure Analysis Surface micromachining Linear Models Computer-Aided Design Equivalent circuit business Pulse-width modulation |
| Zdroj: | IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control. 53:1719-1729 |
| ISSN: | 0885-3010 |
| Popis: | A new approach for fabricating high frequency (>20 MHz) linear array transducers, based on laser micromachining, has been developed. A 30 MHz, 64-element, 74-mum pitch, linear array design is presented. The performance of the device is demonstrated by comparing electrical and acoustic measurements with analytical, equivalent circuit, and finite-element analysis (FEA) simulations. All FEA results for array performance have been generated using one global set of material parameters. Each fabricated array has been integrated onto a flex circuit for case of handling, and the flex has been integrated onto a custom printed circuit board test card for ease of testing. For a fully assembled array, with an acoustic lens, the center frequency was 28.7 MHz with a one-way -3 dB and -6 dB bandwidth of 59% arid 83%, respectively, arid a -20 dB pulse width of -99 ns. The per-element peak acoustic power, for a plusmn30 V single cycle pulse, measured at the 10 mm focal length of the lens was 590 kPa with a -6 dB directivity span of about 30 degrees. The worst-case total cross talk of the combined array and flex assembly is for nearest neighboring elements and was measured to have an average level -40 dB across the -6 dB bandwidth of the device. Any significant deviation from simulation can be explained through limitations in apparatus calibration and in device packaging |
| Databáze: | OpenAIRE |
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