Ensuring Advanced Semiconductor Device Reliability using FA and Submicron Defect Detection

Autor:	Gray, D., Kendig, D., Andrew Tay, Shakouri, A.
Rok vydání:	2019
Předmět:	Electrical and Electronic Engineering Safety Risk Reliability and Quality
Zdroj:	Scopus-Elsevier
ISSN:	1537-0755
DOI:	10.31399/asm.edfa.2019-1.p020
Popis:	A noninvasive thermal imaging approach based on the thermoreflectance principle is proposed for analyzing advanced semiconductor devices. Several examples illustrate the value of this approach in detecting thermal anomalies and defects missed by other techniques.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c0b57fc20d634c3f1f9cc8daaf70504b https://doi.org/10.31399/asm.edfa.2019-1.p020 Zobrazit plný text záznamu Plný text ve formátu PDF