Wafer Processing
| Autor: | Hans-Joachim Möller |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Engineering drawing
Materials science 020209 energy Abrasive Polishing Mechanical engineering Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology Grinding Wafering Lapping 020401 chemical engineering Etching (microfabrication) Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Wafer Wafer dicing 0204 chemical engineering |
| Zdroj: | Handbook of Photovoltaic Silicon ISBN: 9783662527351 |
| Popis: | Artificially grown crystals have to be cut into wafers for further applications. The current wafering techniques are described with a major focus on the dominant multi-wire sawing method. After sawing the wafers may have to be further treated by grinding, lapping, polishing, and etching procedures. The requirements on the processes and wafer qualities depend on the material and the application. The most advanced techniques have been developed for silicon, which is the major material for photovoltaic and microelectronic applications. Multi-wire sawing and the subsequent processes use abrasive particles for material removal. The fine-tuning and optimization of the wafer processes require an understanding of the micromechanical interactions between abrasive particles and crystal. The current status of research and development will be described for the major methods and materials. Finally, a brief overview will be given for alternative wafer processing techniques. |
| Databáze: | OpenAIRE |
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