Elastoplastic and fatigue properties of copper in printed circuit boards : from experimental characterization to numerical simulations
| Autor: | Gautier Girard, Sébastien Mercier, Marion Martiny |
|---|---|
| Přispěvatelé: | Laboratoire d'Etude des Microstructures et de Mécanique des Matériaux (LEM3), Université de Lorraine (UL)-Centre National de la Recherche Scientifique (CNRS)-Arts et Métiers Sciences et Technologies, HESAM Université (HESAM)-HESAM Université (HESAM) |
| Jazyk: | angličtina |
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Materials science Load modeling chemistry.chemical_element 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences Copper Characterization (materials science) Printed circuit board chemistry 0103 physical sciences Hardening (metallurgy) [PHYS.COND.CM-MS]Physics [physics]/Condensed Matter [cond-mat]/Materials Science [cond-mat.mtrl-sci] Kinematic hardening Composite material 0210 nano-technology |
| Zdroj: | 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Jul 2020, Cracow, France. pp.1-5, ⟨10.1109/eurosime48426.2020.9152709⟩ |
| Popis: | International audience; In operation, a Printed Circuit Board (PCB) will face various and repeated thermomechanical loadings that may lead to the failure of the copper, and thus to the malfunction of the PCB itself. In order to simulate and better predict the reliability of PCBs, the constitutive behavior of copper has to be defined. In the present work, a 17 µm rolled annealed copper film frequently used in the flexible PCB industry has been tested under a cyclic tensile-compressive loading. The copper has a low elastic limit and plastic deformation plays thus an important role during straining. Under cyclic loadings, a predominant kinematic hardening has been observed. The plastic behavior of the studied copper film has been identified with a Lemaitre-Chaboche hardening model. Next, an original experimental setup has been developed, allowing to measure the fatigue behavior of thin copper films under cyclic loadings. Tests with various loading amplitudes are carried out. A Coffin-Manson model has been adopted to reproduce the experimental data. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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