Numerical Design and Laboratory Testing of Encapsulated PCM Panels for PCM-Air Heat Exchangers
| Autor: | Luiz C. Wrobel, Thiago Santos, Nick Hopper, Maria Kolokotroni |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: |
Materials science
020209 energy Enhanced heat transfer Mechanical engineering 02 engineering and technology Computational fluid dynamics lcsh:Technology Laboratory testing lcsh:Chemistry 020401 chemical engineering Numerical design PCM-Air heat exchanger Heat exchanger 0202 electrical engineering electronic engineering information engineering General Materials Science 0204 chemical engineering enhanced heat transfer lcsh:QH301-705.5 Instrumentation Fluid Flow and Transfer Processes Pressure drop lcsh:T business.industry Process Chemistry and Technology active LTES General Engineering Phase-change material lcsh:QC1-999 Computer Science Applications lcsh:Biology (General) lcsh:QD1-999 lcsh:TA1-2040 Heat transfer PCM encapsulation lcsh:Engineering (General). Civil engineering (General) business phase change material lcsh:Physics |
| Zdroj: | Applied Sciences Volume 11 Issue 2 Applied Sciences, Vol 11, Iss 676, p 676 (2021) |
| ISSN: | 2076-3417 |
| DOI: | 10.3390/app11020676 |
| Popis: | © 2021 by the authors. Heat transfer between encapsulated PCM panels and air plays an important role in PCM-Air heat exchangers. A new design for the encapsulation panel was developed considering practical aspects such as the cost of production and ease of manufacturing, in addition to heat transfer and pressure drop. A number of encapsulated panel surfaces were first investigated via 3D CFD simulations and compared with an existing panel in use by a commercial PCM-Air heat exchanger manufacturer. After validation, 2D CFD simulations were carried out for 32 different geometries to select the most effective design, which was fabricated and tested in the laboratory. Laboratory parameters tested included heat transfer, pressure drop and melting/solidifying. The laboratory results confirmed the improvements of the new panel in comparison with the existing panel and a flat panel. It was found that the proposed design doubled the heat transfer, holds 13.7% more material and the fan can overcome the increased pressure drop. Thiago Santos would like to thank the Science without Borders program of CNPq-Brazil, for the funding awarded to carry out his PhD at Brunel University London (PDE: 200815/2014-8). |
| Databáze: | OpenAIRE |
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