Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors

Autor: Gautier Girard, Sébastien Mercier, Marion Martiny
Přispěvatelé: Laboratoire d'Etude des Microstructures et de Mécanique des Matériaux (LEM3), Université de Lorraine (UL)-Centre National de la Recherche Scientifique (CNRS)-Arts et Métiers Sciences et Technologies, HESAM Université (HESAM)-HESAM Université (HESAM)
Rok vydání: 2020
Předmět:
Printed circuit boards
Materials science
Mechanical tests
chemistry.chemical_element
02 engineering and technology
Copper film
01 natural sciences
Printed circuit board
[SPI.MECA.MEMA]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Mechanics of materials [physics.class-ph]
0103 physical sciences
0202 electrical engineering
electronic engineering
information engineering
Kinematic hardening
Electrical and Electronic Engineering
Composite material
Safety
Risk
Reliability and Quality
010302 applied physics
Elastic-plastic behavior
Computer simulation
020208 electrical & electronic engineering
Low-cycle fatigue
Condensed Matter Physics
Copper
Atomic and Molecular Physics
and Optics
Flexible electronics
[SPI.TRON]Engineering Sciences [physics]/Electronics
Surfaces
Coatings and Films
Electronic
Optical and Magnetic Materials
Elastic plastic
chemistry
Hardening (metallurgy)
Zdroj: Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2020, 115, pp.113976. ⟨10.1016/j.microrel.2020.113976⟩
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2020.113976
Popis: International audience; The elastic-plastic and low-cycle fatigue behaviors of copper films are studied experimentally and identified for further simulation works. A rolled annealed copper grade is considered here, as it is often used in flexible printed circuit boards for its mechanical resistance to high elongations. During operation, the printed circuit board (PCB) will undergo various loadings, whether purely mechanical or environmental. These loadings can lead to the fracture of copper and thus to the disconnection of the electrical signal in the PCB. Copper has a low yield stress, so it undergoes easily plastic deformation. In the present work, a predominant kinematic hardening has been observed experimentally and modeled with the combined hardening model of Lemaitre-Chaboche. The fatigue behavior has been identified on cyclic loadings at different strain amplitudes. A Coffin-Manson model has been adopted to reproduce experimental data. Identified behaviors have been introduced in a numerical simulation of a flexible PCB under cyclic bending/reverse bending, in order to estimate its mechanical reliability.
Databáze: OpenAIRE
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