High power mm-wave spatial power combiner employing on-chip isolation resistors
| Autor: | Marianna Ivashina, Artem Roev, Rob Maaskant, Marion K. Matters-Kammerer |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
Materials science
Amplifier 020208 electrical & electronic engineering 020206 networking & telecommunications 02 engineering and technology 7. Clean energy Active load law.invention Power (physics) Spatial power combiner law 0202 electrical engineering electronic engineering information engineering Electronic engineering Resistor Electrical impedance Waveguide Electrical efficiency |
| Zdroj: | European Conference on Antenna and Propagation 2020 2020 14th European Conference on Antennas and Propagation (EuCAP) |
| DOI: | 10.23919/eucap48036.2020.9135565 |
| Popis: | A spatial power combiner interfacing four power amplifiers (PAs) with isolation load resistors to a single substrate integrated waveguide (SIW) is presented. The isolation load resistors are envisioned on-chip and have been optimized to provide both the optimal active load impedance for the interconnected PAs as well as to mitigate undesired power combiner coupling effects due to non-equal excitations between PA channels. The proposed solution is compared to an ideal Wilkinson combiner in the presence of non-ideal PAs. The main performance targets are the combined output power, gain, and power efficiency at the 1-dB compression point. Simulation results demonstrate that introducing isolation load resistors allows to significantly reduce the impact of a non-uniform excitation on the combiner performance metrics. |
| Databáze: | OpenAIRE |
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