Silicon: A flexible material for bendable electronics and sensors
Autor: | Yannick Kervran, Tayeb Mohammed-Brahim, Claude Simon, Khalid Kandoussi, Hanpeng Dong, Nathalie Coulon, Sabri Janfaoui, Emmanuel Jacques |
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Přispěvatelé: | Institut d'Électronique et des Technologies du numéRique (IETR), Nantes Université (NU)-Université de Rennes 1 (UR1), Université de Rennes (UNIV-RENNES)-Université de Rennes (UNIV-RENNES)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Université de Rennes (UNIV-RENNES)-Institut National des Sciences Appliquées (INSA)-CentraleSupélec-Centre National de la Recherche Scientifique (CNRS), Université de Nantes (UN)-Université de Rennes 1 (UR1), Université de Nantes (UN)-Université de Rennes (UR)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-CentraleSupélec-Centre National de la Recherche Scientifique (CNRS) |
Rok vydání: | 2016 |
Předmět: |
Silicon
Flexible materials Materials science Bending (metalworking) Mechanical performance chemistry.chemical_element 02 engineering and technology Substrate (electronics) Deformation (meteorology) 01 natural sciences [INFO.INFO-NI]Computer Science [cs]/Networking and Internet Architecture [cs.NI] Microelectronics Flexible plastics Microcrystalline silicon 0103 physical sciences Electronics Mechanical reliability Students Flexible electronics 010302 applied physics business.industry Maximum temperature Temperature Thin film transistors Reproducibilities 021001 nanoscience & nanotechnology Deformation [SPI.TRON]Engineering Sciences [physics]/Electronics chemistry Thin-film transistor Optoelectronics Microcrystalline silicon thin films Commercial applications 0210 nano-technology business |
Zdroj: | 31st Symposium on Microelectronics Technology and Devices, SBMicro 2016 31st Symposium on Microelectronics Technology and Devices, SBMicro 2016, Aug 2016, Horizonte, Brazil. ⟨10.1109/SBMicro.2016.7731313⟩ |
DOI: | 10.1109/sbmicro.2016.7731313 |
Popis: | International audience; Directly crystallized deposited silicon at low temperature is shown to be the right material when bendable system including treatment electronics and sensing functions is needed. This is true particularly when process reproducibility, electrical and mechanical reliability of the devices are the most important parameters implying the success of the technology. Indeed, these parameters are the main issues when we need to go beyond the publication of a paper, towards actual commercial application. Electrical and mechanical performances of microcrystalline silicon thin film transistors and deformation sensors on 25 μm thick flexible plastics under high bending, still 0.75 mm curvature radius, are presented. These devices are fabricated directly on this substrate at a maximum temperature of 180°C. © 2016 IEEE. |
Databáze: | OpenAIRE |
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