Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles
| Autor: | Jong-Hyun Lee, Jun Ho Hwang |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
lcsh:TN1-997 Materials science Metals and Alloys Liquid phase Sintering intermetallic compounds (IMC) 02 engineering and technology 021001 nanoscience & nanotechnology Chip 01 natural sciences Sn-coated Cu 0103 physical sciences lcsh:TA401-492 chip bonding lcsh:Materials of engineering and construction. Mechanics of materials Transient (oscillation) immersion plating Composite material 0210 nano-technology transient liquid phase (TLP) sintering lcsh:Mining engineering. Metallurgy |
| Zdroj: | Archives of Metallurgy and Materials, Vol 62, Iss 2, Pp 1143-1148 (2017) |
| ISSN: | 2300-1909 |
| Popis: | Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles. |
| Databáze: | OpenAIRE |
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