Interface structure and surface morphology of (Co, Fe, Ni)/Cu/Si(100) thin films

Autor:	A. Lukaszew, B. G. Demczyk, Ratna Naik, Gregory W. Auner, Vaman M. Naik
Rok vydání:	1996
Předmět:	Silicon General Physics and Astronomy chemistry.chemical_element Epitaxy Copper Metal Crystallography Nickel chemistry Transmission electron microscopy visual_art visual_art.visual_art_medium Surface roughness Thin film
Zdroj:	Scopus-Elsevier
ISSN:	1089-7550 0021-8979
DOI:	10.1063/1.363548
Popis:	We have examined bilayer Co/Cu, Fe/Cu, and Ni/Cu films deposited by molecular‐beam epitaxy on hydrogen‐terminated [100] silicon substrates. The magnetic metal/copper interface was examined by atomic resolution transmission electron microscopy and compared with the surface morphology as depicted by atomic force microscopy. The general orientation relationships across the magnetic metal/copper interfaces were found to be: [001]Co, Ni∥[001]Cu; (010)Co, Ni∥(010)Cu and [001]Fe∥[001]Cu; (110)Fe∥(200)Cu. The latter system is equivalent to the [11 1]Fe∥[011]Cu and (110)Fe∥(100)Cu Pitsch relationship, as has been reported earlier. Furthermore, there was a general correlation between interfacial and surface roughness, indicating that the initial interface character is propagated throughout the film during growth.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b88b59a0d814413d1d4e4b7c64a4b7b7 https://doi.org/10.1063/1.363548 Zobrazit plný text záznamu