RFID Tag Failure after Thermal Overstress

Autor: Cora Salm, Kevin M. Batenburg, Emre Ozturk, Mike J. Dikkers, Jurriaan Schmitz
Přispěvatelé: Integrated Devices and Systems
Jazyk: angličtina
Rok vydání: 2020
Předmět:
Zdroj: 2019 IEEE International Integrated Reliability Workshop, IIRW 2019
DOI: 10.1109/iirw47491.2019.8989885
Popis: In this work the failure modes and mechanisms are investigated of a commercially available RFID tag, when it is exposed to extreme temperatures well beyond specifications. Both erroneous functioning and malfunctioning are observed after a thermal cycle exposing the tag to an elevated temperature in the 300–550 ° C range. Void formation is the dominant failure, leading to a complete malfunction of the tag. Sporadically, the RFID tag returns a wrong identification code after extreme thermal cycling. This effect is caused by relatively weak bits flipping from “1” to “0” and seems consistent with existing retention models.
Databáze: OpenAIRE