Copper leaching from waste printed circuit boards using typical acidic ionic liquids recovery of e-wastes’ surplus value
| Autor: | Li Yongtong, Wu Yanfei, Bin Yang, Ying-xia Ma, Dong Li, Ding-jun Zhang |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Inorganic chemistry
chemistry.chemical_element 02 engineering and technology 010501 environmental sciences 021001 nanoscience & nanotechnology 01 natural sciences Copper chemistry.chemical_compound Printed circuit board chemistry Leaching (chemistry) Reagent Ionic liquid Particle size 0210 nano-technology Hydrogen peroxide Waste Management and Disposal Copper leaching 0105 earth and related environmental sciences |
| Zdroj: | Waste Management. 78:191-197 |
| ISSN: | 0956-053X |
| DOI: | 10.1016/j.wasman.2018.05.036 |
| Popis: | In this study, using several types of acidic ionic liquids as the leaching reagents, the leaching behaviors of the copper present in waste printed circuit boards (WPCBs) were investigated. The effects of various parameters on the copper leaching rate were studied, such as the particle size of the shredded WPCB, type of ionic liquid used, hydrogen peroxide dosage, solid-to-liquid ratio, leaching temperature, and leaching time. The experimental results showed that the copper leaching rate increases continuously when the powder particle size is increased from 0.071 to 0.500 mm. Moreover, the copper leaching rate also increases with an increase in the leaching temperature. In contrast, the leaching rate first increases and then decreases with increases in the leaching time, hydrogen peroxide dosage, and solid-to-liquid ratio. The optimal conditions that provided a 98.31% copper leaching rate were: particle size >0.500 mm, 8.5 mL 90% (v/v) ionic liquid, 1.5 mL 30% hydrogen peroxide, solid-to-liquid ratio of 1/20, leaching temperature of 80 °C, and leaching time of 2 h. |
| Databáze: | OpenAIRE |
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