Research on Surface Treatment and Interfacial Bonding Technology of Copper-Polymer Direct Molding Process
| Autor: | Feng Yang, Jian Rong, Rongsheng Guo, Guanghong Hu, Qingsong Cao |
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| Rok vydání: | 2021 |
| Předmět: |
Technology
Materials science injection molding microstructure bonding strength chemistry.chemical_element Electrolyte Molding (process) Article chemistry.chemical_compound Etching General Materials Science Composite material Porosity Phosphoric acid chemistry.chemical_classification Microscopy QC120-168.85 QH201-278.5 anodic oxidation Polymer surface treatment Engineering (General). Civil engineering (General) Microstructure Copper TK1-9971 Descriptive and experimental mechanics chemistry copper Electrical engineering. Electronics. Nuclear engineering TA1-2040 |
| Zdroj: | Materials Materials, Vol 14, Iss 2712, p 2712 (2021) Volume 14 Issue 11 |
| ISSN: | 1996-1944 |
| Popis: | To realize the connection of copper and Polyphenylene sulfide (PPS) by metal–polymer direct molding, this paper combined anodic oxidation and chemical corrosion to treat the surface of copper, and carried out the injection molding experiment. An orthogonal experimental arrangement was used to identify the optimal electrolyte and etching solution for preparing a microstructure on a copper surface. The bonding and fracture mechanisms of the copper–polymer assembly were investigated through injection molding experiment and SEM technology. The results revealed that the phosphoric acid concentration had the most significant effect on the microstructure quality and etching solution containing 20% phosphoric acid produced a uniform microstructure with 25.77% porosity and 5.52 MPa bonding strength. Meanwhile, SEM images of the interface from bonding to fracture in the copper–polymer assembly indicated a well-filled polymer in the microstructure with a mainly cohesive fracture mode. |
| Databáze: | OpenAIRE |
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