| Autor: |
Min Seong Kim, Seunghwan Kim, Jungrak Choi, Seonggi Kim, Chankyu Han, Yung Lee, Youngdo Jung, Jaeho Park, Sunjong Oh, Byeong-Soo Bae, Hyuneui Lim, Inkyu Park |
| Rok vydání: |
2021 |
| Předmět: |
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| Zdroj: |
ACS applied materialsinterfaces. 14(1) |
| ISSN: |
1944-8252 |
| Popis: |
In order to realize a transition from conventional to stretchable electronics, it is necessary to make a universal stretchable circuit board in which passive/active components can be robustly integrated. We developed a stretchable printed circuit board (s-PCB) platform that enables easy and reliable integration of various electronic components by utilizing a modulus-gradient polymeric substrate, liquid metal amalgam (LMA) circuit traces, and Ag nanowire (AgNW) contact pads. Due to the LMA-AgNW biphasic structure of interconnection, the LMA is hermetically sealed by a homogeneous interface, realizing complete leak-free characteristics. Furthermore, integration reliability is successfully achieved by local strain control of the stretchable substrate with a selective glass fiber reinforcement (GFR). A strain localization derived by GFR makes almost 50,000% of strain difference within the board, and the amount of deformation applied to the constituent elements can be engineered. We finally demonstrated that the proposed integrated platform can be utilized as a universal s-PCB capable of integrating rigid/conventional electronic components and soft material-based functional elements with negligible signal distortion under various mechanical deformations. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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